陳相宇

陳相宇

In-depth exploration of the latest technological trends, providing clear explanations and analyses, allowing the audience to easily grasp technology trends and innovations.

Listen on Apple Podcasts

低溫 Hybrid Bonding 顛覆 3D IC 堆疊極限:鎖與鑰 Cu/SiO₂ 結構引爆 HBM4 世代

10 mins • May 13, 2025

Recent Episodes

May 13, 2025

低溫 Hybrid Bonding 顛覆 3D IC 堆疊極限:鎖與鑰 Cu/SiO₂ 結構引爆 HBM4 世代

10 mins

May 4, 2025

巴菲特的投資策略是什麼 ?

14 mins

Apr 16, 2025

與川普作對,南韓半導體產業慘了

7 mins

Apr 14, 2025

NVIDIA宣佈美國製造AI超級電腦大計,亞利桑那與德州打造超過百萬平方英尺產能

10 mins

Apr 13, 2025

川普關稅第一戰,大慘敗收場。

8 mins

Language
Chinese
Country
Taiwan
Categories
Feed Host
Request an Update
Updates may take a few minutes.